Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites
Dongli Zhang, Sheng-Nan Liu, Huiwu Cai, Qi‐Kun Feng, Shao‐Long Zhong, Jun‐Wei Zha, Zhi‐Min Dang
Abstract
High-performance epoxy (EP) composites with excellent thermal conductivity and dielectric properties have attracted increasing attention for effective thermal management. In this work, three-dimensional (3D) structural functional fillers were prepared by an electrostatic self-assembly approach. The negatively charged carbon nanotubes (nCNTs) prepared by carboxylation on the surface of CNTs were attached to the positively charged boron nitride (pBN) to form the 3D [email protected] functional fillers. The morphological characterizations of the formed 3D [email protected] fillers and epoxy composites were established, illustrating that nCNTs were linearly overlapped between the BN sheets, thus forming a 3D heat conduction network in the epoxy matrix. The synergistic effect of pBN with nCNTs on the enhancement of thermal conductivity and dielectric properties of composites was systematically studied. The experimental results demonstrated that the thermal conductivity of [email protected]/EP composites could reach 1.986 W m−1K−1 with the loading of 50 wt% fillers at 10:1 mass ratio of pBN:nCNTs, which is 464% and 124% higher than that of pure EP and BN/EP, respectively. Simultaneously, the dielectric permittivity was successfully increased to 15.14. Moreover, the thermal stability of the composites was synchronously enhanced. This study provides a facile path to fabricate thermosetting polymer composites with high thermal conductivity and dielectric properties.