Preparation and performance of low‐dielectric benzocyclobutene resins containing dicyclopentadiene
Song Wu, Qiuxia Peng, Yueting Deng, Qingyu Shi, Jiajun Ma, Yawen Huang, Junxiao Yang
Abstract
Abstract Low‐dielectric‐constant polymer materials are widely used in the electronic industry owing to their unique characteristics. Benzocyclobutene (BCB) resin is one such material with excellent dielectric properties and thermal stabilities. In this work, a novel BCB‐functionalized monomer (DCPDNO‐BCB) was synthesized from 2,6‐dimethyl phenol‐DCPD novolac (DCPDNO) and 4‐Bromobenzocyclobutene through Ullmann coupling. The structure of DCPDNO‐BCB was characterized by 1 H NMR, 13 C NMR, and ESI‐MS, and poly(DCPDNO‐BCB), obtained by ring‐opening and subsequent Diels–Alder reaction at the appropriate temperature, was found to exhibit low dielectric properties ( k = 2.53 at 10 MHz), low water absorption, high thermal stability ( T d 5 = 430°C), and good film flatness.