Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Yinbo Chen, Changchang Wang, Yue Gao, Zhaoqing Gao, Zhi‐Quan Liu

2021Journal of Materials Science Materials in Electronics16 citationsDOI

Topics & Concepts

SolderingTemperature cyclingMaterials scienceEutectic systemMicrostructureJoint (building)MetallurgyPhase (matter)ThermalComposite materialGrain sizeStructural engineeringChemistryThermodynamicsPhysicsEngineeringOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties