Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions
Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Hitoshi Umezawa, Eiji Higurashi
Topics & Concepts
DiamondMaterials scienceWaferAnnealing (glass)CrystallinitySubstrate (aquarium)FabricationWafer bondingComposite materialOptoelectronicsOceanographyGeologyAlternative medicinePathologyMedicineDiamond and Carbon-based Materials ResearchAdvanced Surface Polishing TechniquesAdvanced materials and composites