Effects of Al2O3 on the coefficient of thermal expansion and dielectric properties of borosilicate glasses as an interposer for 3D packaging
Yuan Liu, Tianpeng Liang, Zheng Wei, Yifan Liu, Haolun Fu, Qian Liu, Chongsheng Wu, Jihua Zhang, Hongwei Chen, Libin Gao, Daming Chen, Yuanxun Li
Topics & Concepts
Borosilicate glassMaterials scienceInterposerThermal expansionDielectricThermalEngineering physicsComposite materialOptoelectronicsThermodynamicsPhysicsLayer (electronics)Etching (microfabrication)EngineeringGlass properties and applications3D IC and TSV technologiesAdditive Manufacturing and 3D Printing Technologies