Litcius/Paper detail

Study into grinding force in back grinding of wafer with outer rim

Xianglong Zhu, Yu Li, Zhigang Dong, Renke Kang, Shang Gao

2020Advances in Manufacturing12 citationsDOI

Topics & Concepts

GrindingWaferMaterials scienceNormal forceGrinding wheelRotational speedMechanical engineeringComposite materialMechanicsEngineeringNanotechnologyPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques
Study into grinding force in back grinding of wafer with outer rim | Litcius