Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode
Junming Guan, Yonghua Zhao
Topics & Concepts
WaferMaterials scienceElectrical discharge machiningGrindingMachiningSurface integrityBrittlenessSemiconductorElectrodeSilicon carbideGrinding wheelOptoelectronicsMechanical engineeringComposite materialMetallurgyEngineeringPhysical chemistryChemistryAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesAdvanced machining processes and optimization