Improved mechanical strength, ductility, and electrical conductivity of Cu–Ni–Si alloys after multi-pass continuous extrusion and aging processes
Fangxu Qi, Hongwang Fu, Yuewen Yin, Xinbing Yun
Topics & Concepts
Materials scienceExtrusionUltimate tensile strengthDuctility (Earth science)MicrostructureElectrical resistivity and conductivityElongationGrain sizeMetallurgyComposite materialDeformation (meteorology)Recrystallization (geology)ConductivityCreepBiologyChemistryPaleontologyPhysical chemistryEngineeringElectrical engineeringMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties