Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine
Shan Huang, Xialei Lv, Yao Zhang, Jinhui Li, Shilu Zhou, Siyao Qiu, Zimeng He, Tao Wang, Guoping Zhang, Rong Sun
Abstract
To date, low-temperature curable polyimide (PI) materials have been in great demand in the field of advanced packaging.
Topics & Concepts
PolyimideMaterials scienceDiaminePiSide chainComposite materialGroup (periodic table)Demand sidePolymer chemistryOrganic chemistryLayer (electronics)PolymerChemistryEconomicsBiochemistryMicroeconomicsSynthesis and properties of polymersAdvanced Sensor and Energy Harvesting MaterialsEpoxy Resin Curing Processes