Electrical and chemical analysis of Ti/Au contacts to<i>β</i>-Ga<sub>2</sub>O<sub>3</sub>
Luke A. M. Lyle, Tyson C. Back, Cynthia T. Bowers, Andrew J. Green, Kelson D. Chabak, Donald L. Dorsey, Eric R. Heller, Lisa M. Porter
Abstract
Chemical and electrical measurements of Ti/(010) β-Ga2O3 and Ti/(001) β-Ga2O3 interfaces were conducted as a function of annealing temperature using x-ray photoelectron spectroscopy (XPS), current density–voltage (J–V), and capacitance–voltage (C–V) measurements. XPS revealed partial Ti oxidation at both interfaces in the as-deposited condition, with more Ti oxidation on the (001) β-Ga2O3 epilayer surface than the (010) β-Ga2O3 substrate surface. The amount of oxidized Ti increased with annealing temperature. The Schottky barrier heights for as-deposited (unannealed) Au/Ti/(010) β-Ga2O3 and Au/Ti/(001) β-Ga2O3 contacts as determined from J–V and C–V measurements were between 0.64 and 0.83 eV. Shifts in XPS core level peaks for Ti/(010) β-Ga2O3 suggest that the Schottky barrier height decreases with temperature up to 350 °C for 10-min anneals and increases for 10-min anneals ≥460 °C. Taken together, the results suggest a strong dependence of Ti reactivity on the β-Ga2O3 surface, which can affect the electrical performance and stability of Ti/β-Ga2O3 ohmic contacts at elevated temperatures.