A novel 3D integrated circuit microchannel heat sink with coupled phase change cooling for thermal management of aerospace electronic devices
Ci Ao, Bo Xu, Zhenqian Chen
Topics & Concepts
Materials scienceHeat sinkPhase-change materialThermal resistanceHeat transferComputer coolingHeat transfer coefficientMicrochannelThermal conductivityHeat fluxEnhanced heat transferThermalPressure dropMechanicsComposite materialDissipationJunction temperatureThermodynamicsHeat spreaderTemperature controlHeat pipeNuclear engineeringThermal massWater coolingElectronic engineeringTemperature cyclingCritical heat fluxVoltageThermal reservoirMechanical engineeringThermal management of electronic devices and systemsPhase Change Materials ResearchHeat Transfer and OptimizationThermal properties of materials