Litcius/Paper detail

Influence of single diamond wire sawing of photovoltaic monocrystalline silicon on the feed force, surface roughness and micro-crack depth

Erick Cardoso Costa, Walter Lindolfo Weingaertner, Fábio Antônio Xavier

2022Materials Science in Semiconductor Processing40 citationsDOI

Topics & Concepts

Materials scienceWire speedMonocrystalline siliconSurface roughnessComposite materialDiamondPenetration depthSurface finishWaferTension (geology)SiliconMetallurgyOpticsMechanical engineeringOptoelectronicsUltimate tensile strengthEngineeringPhysicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchTunneling and Rock Mechanics