Epoxy resin-hydrated halt shaped composite thermal control packaging material for thermal management of electronic components
Liyu Zhang, Xuelai Zhang, Weisan Hua, Wenhao Xie, Wenzhuang Zhang, Liqiang Gao
Topics & Concepts
Composite numberMaterials scienceComposite materialThermalHeat transferPhase-change materialEpoxyElectronic packagingThermal greaseElectronic componentMass fractionElectronicsThermal conductivityMechanical engineeringThermodynamicsElectrical engineeringEngineeringPhysicsPhase Change Materials ResearchHeat Transfer and OptimizationThermal properties of materials