A Cooling Strategy for Photovoltaic Modules in Rear Encapsulation Film
Xin Sun, Jin-Biao Wang, Ming-Qing Liao, Qian You, Yaping Zheng, Yuan Liu, Xinxuan Han, Nan Qu, Zheng‐Bai Zhao
Abstract
Heat accumulation poses a significant issue for photovoltaic (PV) modules, leading to reduced electricity generation in cells and accelerated material aging. Improving heat dissipation performance without altering the existing mature structure and functionality of the PV modules presents a formidable, yet highly pragmatic and valuable challenge. This work reports a strategy to construct a boron nitride (BN) filler network in the rear encapsulation film to boost the heat dissipation of PV modules. The thermal conductivity of the fabricated film can be enhanced by 192% with approximately 2 wt % filler content in comparison to the commercial film, while preserving a light reflectivity of 68.4%. The enhanced thermal conductivity of the rear encapsulation film contributes to improved moisture and heat aging resistance, superior high-temperature resistance, and increased electricity generation efficiency for the module. The benefits of improving the thermal conductivity of encapsulation materials for PV modules warrant attention in this field.