Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
Yi Wang, Wei Wu, Dietmar Drummer, Chao Liu, Wanting Shen, Florian Tomiak, Kevin Schneider, Xingrong Liu, Qiming Chen
Abstract
To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron [email protected] ([email protected]), was successfully assembled via reduction of Cu2+. [email protected] hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized. A specific [email protected] hybrid filler (mBN:mCu = 100:2), labeled as [email protected], exhibited remarkable ability in enhancing the thermal conductivity of polybenzoxazine (PBz) composites fabricated through ball milling followed by hot pressing. With 25 wt% of [email protected] hybrid fillers, the thermal conductivity of PBz composites reaches 1.049 W m−1 K−1. Dielectric properties, electrical conductivity, and curing behavior of the composites were also investigated. In addition, Foygel's thermal conduction model was employed to demonstrate the mechanism of [email protected] hybrid filler in improving thermal conductivity.