Clarification of the solid-state diffusion behavior of a copper alloy/aluminum alloy composite interface assisted by position marking of the second phases
Shuke Tian, Fan Zhao, Xinhua Liu
Topics & Concepts
Materials scienceAlloyCopperPosition (finance)DiffusionComposite numberInterface (matter)Solid-stateAluminiumCopper alloyMetallurgyComposite materialThermodynamicsEngineering physicsCapillary numberFinanceEngineeringEconomicsCapillary actionPhysicsAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis