Recent mechanical processing techniques of two-dimensional layered materials: A review
Xuguang Cao, Chengming Jiang, Dongchen Tan, Qikun Li, Sheng Bi, Jinhui Song
Abstract
Recently developed ingenious devices fabrication, van der Waals (vdW) heterojunction integration, and characterization techniques of the novel two-dimensional layered materials (2DLMs) have profoundly promoted the in-depth research in terms of the extraordinary properties of 2DLMs, which are conducive to the precise manipulation of atomically thin layered materials. It is possible to realize the fabrication of the extremely complex electronic and optoelectronic devices in combination with the current hybrid structure at the single atomic–layer scale, which can maximize the unique properties of 2DLMs. Herein, we review the sophisticated and progressive mechanical processing techniques ranging from the exfoliation, the stack methods of vdW heterostructures to the mechanical characterization techniques, and discuss the fundamental principles and detailed steps of each technique. Then, their advantages and drawbacks are pointed out to help the experimentalists to choose a more appropriate experimental method. We hope that this review would broaden the reader's horizon in the matter of the mechanical processing of 2DLMs.