Heterogeneous microstructure enables a synergy of strength, ductility and electrical conductivity in copper alloys
Zhenmin Lai, Yongjin Mai, Hongyi Song, Junjie Mai, Xiaohua Jie
Topics & Concepts
MicrostructureMaterials scienceDuctility (Earth science)CopperUltimate tensile strengthMetallurgyElectrical resistivity and conductivityElongationPowder metallurgyComposite materialConductivityCreepPhysical chemistryChemistryEngineeringElectrical engineeringMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties