Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu
Bingying Wang, Keke Zhang, Yijie Gao, Peng Liu, Bo Liu, Zhansheng Zhang
Topics & Concepts
Materials scienceComposite materialUltimate tensile strengthPlating (geology)SolderingMetallurgyDuctility (Earth science)MicrostructureCreepGeophysicsGeologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties