Adhesion, bonding and mechanical properties of Mo doped diamond/Al (Cu) interfaces: A first principles study
Haonan Xie, Yongtao Chen, Tingbo Zhang, Naiqin Zhao, Chunsheng Shi, Chunnian He, Enzuo Liu
Topics & Concepts
DiamondMaterials scienceDopingMaterial properties of diamondThermal conductivityComposite materialUltimate tensile strengthCondensed matter physicsOptoelectronicsPhysicsAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisAdvanced materials and composites