Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access
Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Shairfe Muhammad Salahuddin, Francky Catthoor, Zsolt Tökei, Chenyun Pan
Abstract
Many promising interconnect materials have been proposed to replace traditional Copper interconnects. To enable a large design space exploration for various emerging interconnect technologies, we develop an efficient interconnect technology/memory co-design. In addition, we propose three H-tree technology options to minimize the H-tree delay and energy overheads of four interconnect materials and benchmark them against their traditional Cu counterparts. Various array-/subarray- and interconnect-level design parameters are co-designed for optimal system performance.
Topics & Concepts
InterconnectionBenchmark (surveying)Static random-access memoryComputer scienceTree (set theory)Embedded systemComputer architectureElectronic engineeringEngineeringComputer hardwareTelecommunicationsGeographyGeodesyMathematical analysisMathematicsCopper Interconnects and ReliabilitySemiconductor materials and devicesLow-power high-performance VLSI design