A new strategy for preparing high strength and high precision diffusion bonding GH536 joints via pulsed current and subsequent heat treatment
Tong Wu, Yuyuan Liu, Qianrun Zhang, Ke Li, Rui Xu, Haohua He, Ce Wang, Panpan Lin, Xin Yue, Tiesong Lin, Peng He
Topics & Concepts
Materials scienceDiffusionDiffusion bondingHigh heatCurrent (fluid)Composite materialNuclear engineeringEngineering physicsNanotechnologyOptoelectronicsThermodynamicsPhysicsEngineeringElectromagnetic Effects on MaterialsIntermetallics and Advanced Alloy PropertiesMetal Alloys Wear and Properties