Microstructure and properties evolution of a Cu–Ni–P alloy with high strength and high conductivity during thermomechanical treatment
Yunqing Zhu, Qian Yu, Lijun Peng, Xujun Mi, Haofeng Xie, Jibao Li, Zengde Li, Yicheng Cao
Topics & Concepts
Materials scienceAlloyPrecipitationUltimate tensile strengthElectrical resistivity and conductivityMicrostructureRecrystallization (geology)SofteningMetallurgyPhase (matter)Precipitation hardeningCopperComposite materialChemistryGeologyEngineeringMeteorologyOrganic chemistryElectrical engineeringPaleontologyPhysicsMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties