Selective metallization of glass with improved adhesive layer and optional hydrophobic surface

Dongxu Huang, Mingqi Huang, Deliang Sun, Bincan Liu, Rui Xuan, Jinshan Liu, Rong Sun, Jinhui Li, Guoping Zhang, Daquan Yu

2021Colloids and Surfaces A Physicochemical and Engineering Aspects13 citationsDOI

Topics & Concepts

Copper platingCopperMaterials scienceLayer (electronics)Plating (geology)AdhesiveAdhesionCoatingGold plating (software engineering)Composite materialMetallurgyElectroplatingEconomicsGeophysicsManagementGeology3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesThin-Film Transistor Technologies