Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system
Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao
Topics & Concepts
Through-silicon viaMaterials scienceCopperSiliconConformal mapLayer (electronics)Deposition (geology)IonComposite materialOptoelectronicsMetallurgyChemistryGeometryBiologyPaleontologyOrganic chemistryMathematicsSedimentElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilitySemiconductor materials and interfaces