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Study on the wettability, intermetallic compound growth, voids formation and mechanical properties of Cu/Sn joints with changes in substrate roughness for electronic packaging

Yibo Hu, Jieshi Chen, Zhen Yi, Yuzhu Han, Yu Gun Chun, Kai Xiong, Shuye Zhang

2025Journal of Materials Science Materials in Electronics14 citationsDOI

Topics & Concepts

Materials scienceIntermetallicWettingSubstrate (aquarium)Surface finishElectronic packagingSurface roughnessComposite materialMetallurgyAlloyGeologyOceanographyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMaterial Properties and Processing
Study on the wettability, intermetallic compound growth, voids formation and mechanical properties of Cu/Sn joints with changes in substrate roughness for electronic packaging | Litcius