Fabrication, mechanical and thermal behaviors of antiperovskite manganese nitride Mn3.1Zn0.5Sn0.4N reinforced aluminum matrix composites
He Cao, Yishi Su, Di Zhang, Qiubao Ouyang
Topics & Concepts
Materials scienceThermal expansionFlexural strengthAntiperovskiteComposite materialNitrideHot pressingLayer (electronics)Thermal Expansion and Ionic ConductivityFerroelectric and Piezoelectric MaterialsMicrowave Dielectric Ceramics Synthesis