Modeling of bonding piezoelectric stack using conductive adhesive with metal-coated polymer fillers
Huazhou Kang, Feng Shu, Zhi Li, Xiaofeng Yang
Topics & Concepts
Materials scienceComposite materialPiezoelectricityAdhesiveStack (abstract data type)Adhesive bondingDissipationPolymerDielectricActuatorElectrical conductorLayer (electronics)OptoelectronicsComputer scienceArtificial intelligenceProgramming languagePhysicsThermodynamicsPiezoelectric Actuators and ControlAdvanced MEMS and NEMS TechnologiesFerroelectric and Piezoelectric Materials