Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding
Mulan Li, Liang Zhang, Li-li Gao, Xi Wang, Chen Chen, Xiao Lu
Topics & Concepts
Materials scienceSolderingIntermetallicLamellar structureNanowirePhase (matter)Composite materialShear strength (soil)MicrostructureMetallurgyNanotechnologyAlloySoil scienceChemistrySoil waterEnvironmental scienceOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties