Novel SiC wafer manufacturing process employing three-step slurryless electrochemical mechanical polishing
Xu Yang, Xiaozhe Yang, Kentaro Kawai, Kenta Arima, Kazuya Yamamura
Topics & Concepts
Materials scienceWaferPolishingChemical-mechanical planarizationSurface roughnessWavinessGrindingSurface finishSilicon carbideSurface finishingComposite materialSlicingDiamondMetallurgyOptoelectronicsMechanical engineeringEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchSemiconductor materials and devices