Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging
Sri Krishna Bhogaraju, Hiren R. Kotadia, Fosca Conti, Armin Mauser, Thomas Rubenbauer, Robert Bruetting, Martin Schneider‐Ramelow, Gordon Elger
Abstract
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Topics & Concepts
SinteringMaterials scienceMicrostructureMetallurgyPorosityComposite materialElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties