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Low-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration

Shuxiao Wang, Qing Wang, Yufei Liu, Lianxi Jia, Mingbin Yu, Peng Sun, Fei Geng, Yan Cai, Zhijuan Tu

2021Microelectronic Engineering24 citationsDOI

Topics & Concepts

Insertion lossCoplanar waveguideMaterials scienceOptoelectronicsThrough-silicon viaTransmission lineChipSiliconTransmission lossElectrical engineeringOpticsComputer scienceEngineeringTelecommunicationsPhysicsMicrowave3D IC and TSV technologiesPhotonic and Optical DevicesSemiconductor Lasers and Optical Devices
Low-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration | Litcius