Formation of subsurface Cu-O-Si system through laser-induced plasma-assisted copper penetration for fabricating robust adhesive copper wire on glass substrate
Kai Wei, Chih-Kuang Lin, Pi‐Cheng Tung, Jeng-Rong Ho, I‐Yu Tsao
Topics & Concepts
CopperMaterials scienceCopper platingComposite materialAmorphous solidPenetration (warfare)AdhesiveLayer (electronics)AdhesionScratchMetallurgyElectroplatingCrystallographyChemistryEngineeringOperations researchLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials Research