Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration
Jiaqiang Huang, Yunhui Zhu, Kunhong Pan, Xudong Wang, Zhaoling Huang, Dawei Xiao, Hongjie Jiang, Hongjie Jiang
Topics & Concepts
ElectromigrationMaterials scienceIntermetallicBall grid arrayAnodeSolderingCathodeJoule heatingCurrent densityMetallurgyDissolutionEutectic systemComposite materialAlloyElectrodeChemical engineeringChemistryPhysicsEngineeringPhysical chemistryQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties