Machine learning for board-level drop response of BGA packaging structure
Minghui Mao, Wenwu Wang, Changheng Lu, Fengrui Jia, Xu Long
Topics & Concepts
Ball grid arraySolderingDrop (telecommunication)Printed circuit boardDrop testMaterials scienceDrop impactElectronic packagingReliability (semiconductor)Finite element methodIntegrated circuit packagingStress (linguistics)Strain energy density functionSurface-mount technologyComposite materialStructural engineeringMechanical engineeringElectronic engineeringEngineeringElectrical engineeringIntegrated circuitOptoelectronicsPower (physics)PhysicsQuantum mechanicsWettingLinguisticsPhilosophyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrostatic Discharge in Electronics