Molecular dynamics simulations of key physical properties and microstructure of epoxy resin cured with different curing agents
Shuaijiang Ma, Ping Chen, Jilei Xu, Xuhai Xiong
Topics & Concepts
EpoxyCuring (chemistry)Materials scienceComposite materialMicrostructureMolecular dynamicsThermal expansionSide chainPolymerComputational chemistryChemistryEpoxy Resin Curing ProcessesSilicone and Siloxane ChemistryPolymer Nanocomposites and Properties