Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups
Yao Zhang, Shan Huang, Xialei Lv, Kuangyu Wang, Huimin Yin, Siyao Qiu, Jinhui Li, Guoping Zhang, Rong Sun
Abstract
Fan-out wafer-level packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission losses at high frequencies.
Topics & Concepts
DielectricDissipationDissipation factorWaferMaterials scienceDielectric lossComposite materialTransmission (telecommunications)High-κ dielectricPolymer chemistryOptoelectronicsElectrical engineeringThermodynamicsPhysicsEngineeringSynthesis and properties of polymers3D IC and TSV technologiesEpoxy Resin Curing Processes