Microstructure and thermal properties of copper matrix composites reinforced by 3D carbon fiber networks
Hongda Guan, Xinbo He, Pengfei Zhu, Zijian Zhang, Tao Zhang, Xuanhui Qu
Topics & Concepts
Materials scienceThermal conductivityComposite materialMicrostructureComposite numberCopperThermal transferThermalFiberIsotropySinteringHeat transferMetallurgyLayer (electronics)MeteorologyPhysicsThermodynamicsQuantum mechanicsAluminum Alloys Composites PropertiesFiber-reinforced polymer compositesCellular and Composite Structures