Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
Guanghai Fei, Lei Nie, Lipeng Zhong, Qimin Shi, Kehui Hu, Cesar Parra‐Cabrera, Herman Oprins, Rob Ameloot, Shoufeng Yang
Topics & Concepts
Materials scienceStereolithographyThermal expansionMicrofluidicsPrinted circuit boardComposite material3d printedTemperature cycling3D printingThermalElectronic packagingNanotechnologyBiomedical engineeringMeteorologyMedicinePhysicsComputer scienceOperating systemAdditive Manufacturing and 3D Printing TechnologiesPhotopolymerization techniques and applicationsNanofabrication and Lithography Techniques