Tuning thermal expansion coefficient of copper-multilayer graphene thermal management materials through tailoring interfacial microstructure
Xueliang Wang, Xueliang Wang, Yongsheng Liu, Xin Wang, Xin Wang, Yaping Wang, Tao Lai, Guofu Ren
Topics & Concepts
Materials scienceThermal expansionComposite materialCopperGrapheneMicrostructureComposite numberGrain boundaryVolume fractionElectronic packagingMetallurgyNanotechnologyAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisThermal properties of materials