Stereolithographic additive manufacturing diamond/SiC composites with high thermal conductivity for electronic 3D-packaging applications
Ruiguang Chen, Qin Lian, Dichen Li, Xiaoning He, Shuaiwei Wang, Jian Zhuang
Topics & Concepts
Materials scienceStereolithographyDiamondThermal conductivityComposite materialComposite numberMicrostructureElectronic packagingThermalMeteorologyPhysicsAdditive Manufacturing and 3D Printing TechnologiesDiamond and Carbon-based Materials ResearchInjection Molding Process and Properties