Stable bonding of W and ODS steel fabricated by TLP diffusion technology through inserting a novel composite interlayer Zr/Cu
Jingwen Zhang, Liming Yu, Yongchang Liu, Chenxi Liu, Zongqing Ma, Huijun Li, Zumin Wang, Dijun Long
Topics & Concepts
Materials scienceDiffusion bondingIntermetallicComposite numberDiffusion weldingMetallurgyBrittlenessComposite materialOxideUltimate tensile strengthDiffusionAnodic bondingFOIL methodLayer (electronics)WeldingAlloyPhysicsThermodynamicsFusion materials and technologiesAdvanced materials and compositesMetal and Thin Film Mechanics