Improvement of Bondability by Addition of Carboxylic Acid to the Sinter-Bonding Paste Containing Bimodal-Sized Cu Particles and Rapid Bonding in Air
Doyeop Namgoong, Kim S. Siow, Jong‐Hyun Lee
Topics & Concepts
Materials scienceCarboxylic acidComposite materialOxideShear strength (soil)MetallurgyPolymer chemistrySoil scienceEnvironmental scienceSoil waterElectronic Packaging and Soldering Technologies3D IC and TSV technologiesSemiconductor materials and interfaces