Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
John H. Lau, Xuejun Fan
Abstract
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Topics & Concepts
Materials scienceThermal management of electronic devices and systemsNanotechnologyEngineeringMechanical engineering3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies