Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process
Sana Zulfiqar, Abdullah Aziz Saad, M.F.M. Sharif, Zambri Samsudin, M.Y.T. Ali, Fakhrozi Che Ani, Zubair Ahmad, M.K. Abdullah
Topics & Concepts
ThermoformingPrinted circuit boardSubstrate (aquarium)InterconnectionMaterials scienceElectronic circuitFlip chipEngineering drawingMechanical engineeringComposite materialAdhesiveComputer scienceElectrical engineeringEngineeringLayer (electronics)GeologyComputer networkOceanographyAdditive Manufacturing and 3D Printing TechnologiesAdvanced Sensor and Energy Harvesting MaterialsNanomaterials and Printing Technologies