Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints
Yanqing Lai, Shi Chen, Xiaolei Ren, Yuanyuan Qiao, Ning Zhao
Topics & Concepts
Materials scienceMorphology (biology)SolderingMetallurgyComposite materialNanotechnologyGeneticsBiologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies