A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
Yu Zhang, Renke Kang, Shang Gao, Jinxing Huang, Xianglong Zhu
Topics & Concepts
GrindingMaterials scienceGritGrinding wheelWaferMetallurgyComposite materialNanotechnologyPsychologyDevelopmental psychologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques