Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations
Tao Ma, Shiqiang Zhang, Zhihang Zhang, Yue Zhao, Wei Shao, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang, Jian Yang
Topics & Concepts
Materials scienceSolderingKineticsMolecular dynamicsMechanism (biology)Joint (building)MetallurgyDynamics (music)Composite materialThermodynamicsComputational chemistryStructural engineeringQuantum mechanicsEpistemologyAcousticsPhysicsEngineeringChemistryPhilosophyElectronic Packaging and Soldering TechnologiesMetallurgy and Material FormingAluminum Alloys Composites Properties