Sub-grain formation in Al–Li–Mg–Zn–Cu lightweight entropic alloy by ultrasonic hammering
Ruixuan Li, Xin Li, Jiang Ma, Yong Zhang
Topics & Concepts
Materials scienceAlloyMicrostructureIndentation hardnessUltrasonic sensorSimaMetallurgyGrain sizeDendrite (mathematics)Composite materialElastic modulusModulusAcousticsMathematicsGeologyPhysicsGeophysicsGeometryHigh Entropy Alloys StudiesAdditive Manufacturing Materials and ProcessesAluminum Alloys Composites Properties