Effect of critical properties of epoxy molding compound on warpage prediction: A critical review
Sukrut Prashant Phansalkar, Changsu Kim, Bongtae Han
Topics & Concepts
EpoxyMolding (decorative)Materials scienceDigital image correlationViscoelasticityThermal expansionPredictabilityMechanical engineeringGlass transitionSpectrum analyzerComputer scienceComposite materialEngineeringPolymerMathematicsTelecommunicationsStatisticsElectronic Packaging and Soldering TechnologiesMechanical Behavior of CompositesEpoxy Resin Curing Processes